发明名称 |
Multilayer ceramic board and manufacturing method thereof |
摘要 |
The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.
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申请公布号 |
US2010300733(A1) |
申请公布日期 |
2010.12.02 |
申请号 |
US20090458780 |
申请日期 |
2009.07.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
KIM YONG SUK;CHANG BYEUNG GYU;YOO WON HEE;OH YONG SOO |
分类号 |
H05K1/09;B05D5/12;B32B38/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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