发明名称 Multilayer ceramic board and manufacturing method thereof
摘要 The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.
申请公布号 US2010300733(A1) 申请公布日期 2010.12.02
申请号 US20090458780 申请日期 2009.07.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD 发明人 KIM YONG SUK;CHANG BYEUNG GYU;YOO WON HEE;OH YONG SOO
分类号 H05K1/09;B05D5/12;B32B38/00 主分类号 H05K1/09
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