HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipating substrate improved in heat dissipation functions, and to provide a method of manufacturing the same.

SOLUTION: The heat dissipating substrate includes an insulating member 114, a first core substrate 112a and a second core substrate 112b. The first core substrate includes inner walls of a first via hole 104a and first through hole 106a and mounted on the upper side of the insulating member 114. In the surface of the first core substrate, a first circuit layer 110a is formed on a first metal core 102a having a first anodized insulating film 108a formed thereon. The second core substrate is electrically connected to the first core substrate 112a and includes inner walls of the second via hole 104b and second through hole 106b and mounted on the lower side of the insulating member 114. In the surface of the second core substrate, a second circuit layer 110b is formed on a second metal core 102b having a second anodized insulating film 108b formed thereon.

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