发明名称 METHOD OF PLANARIZING A COATING LAYER, AND METHOD OF MANUFACTURING A SUPPORTING APPARATUS
摘要 PURPOSE: A method of planarizing a coating layer and a method of manufacturing a supporting apparatus are provided to maintain the thickness of the coating layer by grinding the coating layer so that a basic material is closely contacted with a base plate. CONSTITUTION: A basic material(210) supporting a substrate is prepared. The coating layer(220) is formed on the top side of the base material. The base material is arranged on the base plate of a polishing device(100). The basic material is closely contacted with the base plate to be flat. The coating layer is ground to be flat.
申请公布号 KR20100126636(A) 申请公布日期 2010.12.02
申请号 KR20100103380 申请日期 2010.10.22
申请人 MICO C&C 发明人 PARK, YONG GYUN;YOON, IN SU;PARK, HEE WON
分类号 H01L21/304;H01L21/687 主分类号 H01L21/304
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