The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
申请公布号
WO2010117098(A3)
申请公布日期
2010.12.02
申请号
WO2009KR01857
申请日期
2009.04.10
申请人
SK CHEMICALS CO., LTD.;HWANG, DONG-JUNE;LIM, JAE-BONG;LEEM, SEUNG-DO;KIM, TAE-YOUNG;BAE, SUNG-SU