| 摘要 |
PROBLEM TO BE SOLVED: To improve an environmental problem by using external connection terminals or semiconductor element mounting terminals, the terminals being the ones in which used amount of lead is reduced, and to achieve a fine pitch of the terminals. SOLUTION: A metal layer 16 is formed at a recessed part 44 on the surface of a support 40 and is covered with an insulating resin 22, a conductor via 26 is formed in a via hole 46 where the metal layer is exposed, an insulating resin layer 22 and a wiring layer 24 are laminated, the semiconductor element loading terminal 18 is formed on a top surface, and then the support 40 is removed. Thus, a bump 12 as the external connection terminal covered with the metal layer 16 is exposed on the lowest surface. COPYRIGHT: (C)2011,JPO&INPIT |
