| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder paste composition which can achieve an extremely high level of printability and bleeding suppression effect (even after continuous printing) without causing degradation of stability during storage and solder bonding failure. <P>SOLUTION: The solder paste composition is characterized by containing solder alloy powder, thermoplastic resin powder with a lower melting temperature than the solder alloy and flux. The solder paste composite is effective in bringing the extremely high level of printability and bleeding suppression effect during continuous printing, without causing the degradation of stability during storage, the solder bonding failure, and rejection at an appearance inspection. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
