| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component that has no occurrence of poor hermeticity even if a through hole for fixing a signal terminal is enlarged to increase the characteristic impedance, and also to provide an electronic device using the same. SOLUTION: The package for mounting an electronic component includes a substrate 1 and signal terminals 4. The substrate 1 has a cover joining portion 1b in an outer peripheral region of the top face, a portion 1a for mounting an electronic component 5, and a plurality of through holes 2, 2 that pass through the substrate 1 from the top to bottom faces in a region on the inner side of the outer peripheral region. The signal terminals 4 are fixed through a sealing material 3 filled in the through holes 2. The through holes 2 each have a large diameter portion 2a and a small diameter portion 2b, and the signal terminals 4 are fixed through the sealing material 3 filled in the larger diameter portions 2a. The through holes 2 each have the large diameter portion 2a on the bottom face side of the substrate 1 and the small diameter portion 2b on the top face side of the substrate 1, and the sealing material 3 is filled in the large diameter portion 2a of each through hole 2 with a space to a step surface 2c on the small diameter portion 2b side. By setting the sealing material 3 apart from the cover joining portion 1b, a poor hermeticity is suppressed and at the same time impedance matching can be achieved. COPYRIGHT: (C)2011,JPO&INPIT |
