| 摘要 |
A method for manufacturing a light-emitting diode includes the steps of: growing a light-emitting diode structure-forming semiconductor layer of a compound semiconductor having a zincblende crystal structure on a first substrate formed of a compound semiconductor having a zincblende crystal structure and that has a principal surface tilted in a [110] direction with respect to a (001) plane; bonding the first substrate to a second substrate on the side of the semiconductor layer; removing the first substrate so as to expose the semiconductor layer; forming an etching mask on the exposed surface of the semiconductor layer in a rectangular planar shape so that a longer side extends in a [110] or [−1-10] direction, and that a shorter side extends in a [−110] or [1-10] direction; and patterning the semiconductor layer by wet etching using the etching mask.
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