| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a vacuum deposition device preventing adhesion of a splash to a substrate while improving the efficiency of using a vapor deposition material. <P>SOLUTION: In the vacuum deposition device, a vaporizing source 40 has a plurality of chimneys (cylindrical parts) 42 and a deposition film is formed on the opposing substrate T by releasing vapor of the deposition material from the chimneys. Distance L1 between the distal end part of the chimney and the substrate is set to be 100 mm or less and, thereby, the amount of deposition of vaporized substance to the substrate located just above the chimney is increased. As a result, the deposition rate is improved and the efficiency of using the vapor deposition material can be enhanced. Further, arrival of the splash at the substrate can be effectively prevented since the vacuum deposition device has the chimneys. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
