| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is made compact. SOLUTION: An opening 9 is formed on a tape substrate 2, and a cantilever type extension portion 3b extends from an inner peripheral edge 9e. An end 3b1 of the cantilever-type extension portion 3b and a chip terminal 6 of a semiconductor chip 1 are jointed, and the joint portion is sealed with a sealing resin 5. In the opening 9, neither the tape substrate 2 nor a stress buffer layer 4 is arranged, and only the sealing resin 5 is present. COPYRIGHT: (C)2011,JPO&INPIT
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