发明名称 Power semiconductor module with connector device
摘要 <p>The power semiconductor module has housing, a connecting mechanism, and a circuit carrier with a power electronic circuit arrangement. An electrical charge connecting element and a control connecting element are provided for connection with an external power line. A connecting device is arranged with the housing in irreversible connecting manner. The connecting device is made of aluminum or zinc die-casting.</p>
申请公布号 EP2256805(A2) 申请公布日期 2010.12.01
申请号 EP20100003120 申请日期 2010.03.24
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 BOGEN, INGO;WALTER, ALEXEJ
分类号 H01L25/07;H01L23/04 主分类号 H01L25/07
代理机构 代理人
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