发明名称 |
Power semiconductor module with connector device |
摘要 |
<p>The power semiconductor module has housing, a connecting mechanism, and a circuit carrier with a power electronic circuit arrangement. An electrical charge connecting element and a control connecting element are provided for connection with an external power line. A connecting device is arranged with the housing in irreversible connecting manner. The connecting device is made of aluminum or zinc die-casting.</p> |
申请公布号 |
EP2256805(A2) |
申请公布日期 |
2010.12.01 |
申请号 |
EP20100003120 |
申请日期 |
2010.03.24 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG |
发明人 |
BOGEN, INGO;WALTER, ALEXEJ |
分类号 |
H01L25/07;H01L23/04 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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