| 发明名称 |
A METHOD FOR MANUFACTURING A TEMPLATE FOR FORMING SOLDER BUMP |
| 摘要 |
PURPOSE: A method for manufacturing a template for forming a solder bump is provided to reduce manufacturing costs by forming a protective layer using molybdenum which is inexpensive and has excellent anti-corrosive properties. CONSTITUTION: A protective film is formed by using molybdenum on the top of a substrate(S1). A pattern in formed on the protective film to correspond with the position of a groove(S2). The groove is formed by etching the substrate according to the pattern(S3). The protective film is removed from the substrate(S4).
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| 申请公布号 |
KR20100126030(A) |
申请公布日期 |
2010.12.01 |
| 申请号 |
KR20090045058 |
申请日期 |
2009.05.22 |
| 申请人 |
LIGADP CO., LTD. |
发明人 |
SHIN, DONG OK;JUNG, SEUNG HO |
| 分类号 |
H01L21/60;H01L23/48 |
主分类号 |
H01L21/60 |
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