UNIVERSAL TEST SOCKET AND SEMICONDUCTOR PACKAGE TESTING APPARATUS USING THE SAME

摘要

PURPOSE: A universal test socket and a semiconductor package testing apparatus using the same are provided to improve the test efficiency thereof by reducing test socket mounting time. CONSTITUTION: A housing frame(100) is formed in plural pin holes inside a protrusion unit protruding toward a side wall. A pin plate assembly includes a pin plate on which plural test pins are arranged and guide pins which are formed on an external plane of the pin plate. The pin plate assembly is connected to the housing frame, and a package unit(300) is placed at an upper portion of the pin plate assembly to enable the connection between the housing frame and the pin plate assembly.