发明名称 Electronic component mounting apparatus
摘要 The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
申请公布号 US7841073(B2) 申请公布日期 2010.11.30
申请号 US20080109647 申请日期 2008.04.25
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 MITSUMOCHI YUTAKA;ONOGUCHI YOSHIHIRO;IIZUKA MASAMI;KOBAYASHI HIROOMI;OYAMA KAZUYOSHI;KASHITANI HISAYOSHI;IZUHARA KOICHI
分类号 B23P19/00 主分类号 B23P19/00
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