发明名称 Mold for forming a molding member and method of fabricating a molding member using the same
摘要 There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
申请公布号 US7842219(B2) 申请公布日期 2010.11.30
申请号 US20060995196 申请日期 2006.06.26
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 JUNG JUNG HWA;LEE CHUNG HOON
分类号 B29C45/14;B29C45/26;H01L21/56 主分类号 B29C45/14
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