HEATSINK AND METHOD OF FABRICATING SAME

摘要

A heatsink assembly (10) for cooling a heated device (50) includes a ceramic substrate (64) having a plurality of cooling fluid channels (26) integrated therein. The ceramic substrate (64) includes a topside surface (56) and a bottomside surface (68). A layer of electrically conducting material (62) is bonded or brazed to only one of the topside and bottomside surfaces (66), (68) of the ceramic substrate (64). The electrically conducting material (62) and the ceramic substrate (64) have substantially identical coefficients of thermal expansion.