| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a MEMS microphone semiconductor device in which reliability is improved by suppressing entry of cutting water or cutting dust during processing for dicing, and to provide a method of manufacturing the same. <P>SOLUTION: The MEMS microphone semiconductor device includes: a substrate; one or more semiconductor elements mounted on a first principal surface of the substrate; a case fixed on the first principal surface of the substrate for covering the one or more semiconductor elements; a through-hole which is formed on the substrate or on the case and becomes a sound hole; and a plurality of connecting electrodes formed on a second principal surface, that is opposite to the first principal surface, of the substrate, wherein entry suppression shaping is applied to the through-hole so as to suppress the entry of cutting water during dicing. <P>COPYRIGHT: (C)2011,JPO&INPIT |
