| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a coating method for a protective film by which a wafer can be coated uniformly with the protective film. <P>SOLUTION: The coating method for the protective film is provided by which a machined surface of the wafer is coated with the protective film composed of a water-soluble resin. The coating method includes a wafer holding step of holding the wafer by a holding table having a holding surface for holding the wafer while a non-machined surface side of the wafer is opposed to the holding surface, a hydrophilicity imparting step of making the machined surface hydrophilic by irradiating the machined surface of the wafer with ultraviolet light to generate ozone and also to generate active oxygen, and a protective film coating step of coating the machined surface made hydrophilic with the water-soluble resin to form the protective film. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
