发明名称 |
PHOTOSENSITIVE ADHESIVE RESIN COMPOSITION, ADHESIVE FILM AND LIGHT-RECEIVING DEVICE |
摘要 |
A photosensitive adhesive resin composition includes (A) a compound having a hydroxyl group or a carboxyl group, and a (meth)acryloyl group, (B) a resin which cures with the compound (A) by thermal treatment, (C) a compound having a (meth)acryloyl group and not having a hydroxyl group and a carboxyl group, (D) a phenol resin or a phenol compound, and (E) a photoactive compound. The photosensitive adhesive resin composition has excellent developability, and is used for producing a spacer formed between a transparent substrate and a substrate on which a semiconductor element is formed. An adhesive film and a light-receiving device are produced using the photosensitive adhesive resin composition.
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申请公布号 |
US2010297439(A1) |
申请公布日期 |
2010.11.25 |
申请号 |
US20080599685 |
申请日期 |
2008.05.27 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
TAKAYAMA RIE;TAKAHASHI TOYOSEI |
分类号 |
G03F7/004;B32B7/12;B32B27/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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