发明名称 GROOVE ON COVER PLATE OR SUBSTRATE
摘要 An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.
申请公布号 WO2010002496(A3) 申请公布日期 2010.11.25
申请号 WO2009US43194 申请日期 2009.05.07
申请人 QUALCOMM MEMS TECHNOLOGIES, INC.;LIN, PENG CHENG 发明人 LIN, PENG CHENG
分类号 B81C1/00 主分类号 B81C1/00
代理机构 代理人
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