| 发明名称 |
SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY |
| 摘要 |
Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder. |
| 申请公布号 |
KR20100123858(A) |
申请公布日期 |
2010.11.25 |
| 申请号 |
KR20107019834 |
申请日期 |
2009.03.12 |
| 申请人 |
VERTICAL CIRCUITS, INC. |
发明人 |
MC ELREA SIMON J.S.;ROBINSON MARC E.;ANDREWS LAWRENCE DOUGLAS JR. |
| 分类号 |
H01L23/48;H01L23/04;H01L23/12 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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