| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a component built-in circuit substrate capable of ensuring packaging quality such as bondability of the bump by eliminating wet washing after flip-chip mounting. <P>SOLUTION: In manufacturing a component built-in circuit substrate in which an electronic component 7 with bump is mounted on a core layer 1 with a plurality of laminated wiring layers, an oxide film 3c made on a surface 3b of a wiring circuit 3 formed on the mounting surface side is removed by plasma-processing the mounting surface where the electronic component 7 is mounted after a resin sealing step for filling a resin into a gap between the core layer 1 after parts mounting and the electronic component 7 and curing and sealing it. Therefore, after flip-chip mounting, no wet washing is required. This prevents failure such as bump bondability deterioration due to wet washing and ensures high packaging quality. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
