Conductive ball mounting method and apparatus

摘要

There is provided a method of mounting conductive balls 22 on pads on a substrate 10. The method includes: (a) placing the substrate 10 having the pads 12b, 14b coated with an adhesive 18 over a container 32 for containing the conductive balls 22 therein and whose top surface is open such that the pads 12b, 14b face the top surface of the container 32; and (b) throwing up the conductive balls 22 in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls 22 to adhere to the adhesive 18 coated on the pads 12b, 14b. Step (b) is repeatedly performed.