发明名称 Micromodules including integrated thin film inductors
摘要 Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
申请公布号 US7838964(B2) 申请公布日期 2010.11.23
申请号 US20090392971 申请日期 2009.02.25
申请人 FAIRCHILD SEMICONDUCTOR CORPORATION 发明人 CAROBOLANTE FRANCESCO;HAWKS DOUGLAS ALAN
分类号 H01L29/00 主分类号 H01L29/00
代理机构 代理人
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