| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-density substrate with built-in components, for which the number of manufacturing processes is small, without generating the short-circuit of the built-in components, when mounting electronic components on a surface of a circuit board, and to provide a method for manufacturing the substrate. <P>SOLUTION: After mounting electronic components (5a, 5b) to metal foil (1a) by fixing them to the metal foil with adhesives (10, 12), the adhesives (10, 12) are hardened. A gap (14) for incorporating the electronic component (4) and an inner via (15) filled with conductive resin paste for performing interlayer electric connection are formed on thermosetting insulating resin sheets (3a, 3b), and the thermosetting insulating resin sheets (3a, 3b) and a core substrate (21) are laminated and integrated in the state of incorporating the electronic components (5a, 5b) in the thermosetting resin sheets (3a, 3b). The metal foil (1a) is worked into a desired wiring pattern (1) and the connection terminal (11) of the built-in electronic components (5a, 5b) is exposed and bonded with the wiring pattern (1) by a conductive member (4). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
