发明名称 |
Method for manufacturing printed circuit board |
摘要 |
A method of manufacturing a printed circuit board including: forming a heat dissipating coating layer on the surface of a heat dissipating layer; forming circuit patterns on the surface of an insulating layer, and forming an inter-layer conductive part joining with the insulating layer by passing through the insulating layer and electrically connected with the circuit patterns; and laminating the insulating layer on the heat dissipating layer such that the inter-layer conductive part is connected with the heat dissipating coating layer.
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申请公布号 |
US2010288726(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20100805372 |
申请日期 |
2010.07.27 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE EUNG-SUEK;YANG DEK-GIN;KIM KEUN-HO |
分类号 |
H01B13/00;B32B37/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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