| 摘要 |
PROBLEM TO BE SOLVED: To improve quality and yield by forming a resist film uniformly in a resist film forming device for forming a resist film on a surface during a processing step of a photomask or a wafer. SOLUTION: In the resist film forming device, a recess 14 for fitting and holding a photomask 15 is formed in a substrate holding part 13 of a substrate holding and rotating means 12, an air channel forming part 16 in which an opening 17 according to the photomask 15 is formed is provided above a part other than the recess 14 of the substrate holding part 13, and thereby, an air channel is formed to an outer peripheral side from the opening 17 side by rotation through a gap g relative to the substrate holding part 13. COPYRIGHT: (C)2011,JPO&INPIT
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