发明名称 |
SEMICONDUCTOR CHIP PACKAGE |
摘要 |
A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An encapsulation layer covers the semiconductor chip. A metallization layer is applied above the first surface of the chip and the encapsulation layer. The metallization layer includes contact areas connected with the contact elements of the chip. External pins are connected with the contact areas.
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申请公布号 |
US2010289135(A1) |
申请公布日期 |
2010.11.18 |
申请号 |
US20090466524 |
申请日期 |
2009.05.15 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF;HOEGLAUER JOSEF |
分类号 |
H01L23/52;H01L21/60;H01L21/78 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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