| 摘要 |
A curable liquid epoxy resin composition comprising: (I) a liquid epoxy resin; (II) an acid anhydride; (III) a diorganosiloxane represented by the following general formula: A-R2—(R12SiO)nR12Si—R2-A {where R1 designates identical or different, substituted or unsubstituted univalent hydrocarbon groups, which are free of aliphatic unsaturated bonds; R2 designates bivalent organic groups; “A” represents a siloxane residue radical expressed by the following average unit formula: (XR12SiO1/2)a(SiO4/2)b (where R1 is the same as defined above, X designates a single bond, a hydrogen atom, a group designated by R1, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; however, in one molecule at least one X should be represented by a single bond, and at least two groups designated by X should be represented by epoxy-containing alkyl groups; “a” is a positive number; “b” is a positive number; and a/b is a number ranging from 0.2 to 4); and “n” is an integer equal to or greater than 1}; and (IV) an inorganic filler, possesses excellent handleability and workability and that, when cured, forms a cured product of excellent adhesiveness in combination with low modulus of elasticity.
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