| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage on a second substrate and an electrode pad in manufacturing a semiconductor package by joining a first substrate, in which a semiconductor chip is formed, to the second substrate for forming a protective cap of the semiconductor chip by an upper surface and a side surface. SOLUTION: A first recess is formed on the second substrate and the first recess assures a space the electrode pad, for jointing the substrate, and a second recess is formed from the rear side of the surface to which the first substrate is jointed, on the second substrate for reaching the first recess. COPYRIGHT: (C)2011,JPO&INPIT |
