| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination of a side face in forming a resist film, to reduce processes and to improve a yield, in relation to a device for forming a resist film for forming the resist film on a surface in a processing process of a photomask or a wafer. SOLUTION: This device 11 for forming a resist film for executing a process of forming the resist film by applying a resist liquid on a photomask 17 and rotating the photomask is structured such that a recessed part 14 for fitting and holding the photomask 17 thereto is formed on a substrate holding part 13 of a substrate holding/rotating means 12, and a predetermined number of resist passage parts 15 are formed from side parts of the recessed part 14 of the substrate holding part 13 to outer peripheral parts thereof. COPYRIGHT: (C)2011,JPO&INPIT
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