发明名称 |
Structure and method of forming a multiple leadframe semiconductor device |
摘要 |
A semiconductor device (20) has a first leadframe (200) with a first semiconductor die (70) electrically coupled to one of its leads. A second semiconductor die (130) is mounted to a second leadframe (300) that has a first lead (35, 150) electrically coupled to the second semiconductor die and a second lead (30, 35) mounted to the lead of the first leadframe.
|
申请公布号 |
US2003209804(A1) |
申请公布日期 |
2003.11.13 |
申请号 |
US20020133527 |
申请日期 |
2002.04.26 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
KNAPP JAMES H.;GERMAIN STEPHEN C. ST. |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|