发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.
申请公布号 US2010290172(A1) 申请公布日期 2010.11.18
申请号 US20100781058 申请日期 2010.05.17
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MOTOKI AKIHIRO;OGAWA MAKOTO;KAWASAKI KENICHI;TAKEUCHI SHUNSUKE
分类号 H01G4/008;H01G4/00;H01G4/005;H01G4/228 主分类号 H01G4/008
代理机构 代理人
主权项
地址