<p>According to various aspects, exemplary embodiments are provided of EMI shielding materials. In one exemplary embodiment, an EMI shielding material generally includes a conductive metal layer disposed on a thin carrier film. The EMI shielding material may be sufficiently compliant such that the conductive metal layer and thin carrier film are capable of conforming to an irregular surface when the EMI shielding material is applied to the irregular surface.</p>
申请公布号
WO2010132049(A1)
申请公布日期
2010.11.18
申请号
WO2009US43716
申请日期
2009.05.13
申请人
LAIRD TECHNOLOGIES, INC.;MCBAIN, DOUGLAS, S.;HILL, RICHARD, F.