| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor device manufacturing jig and the manufacturing method of the semiconductor device which can prevent adhesive from remaining at a level difference portion of dicing region. SOLUTION: A mask 10 comprises a contact 11, an opening 12, a concave 13a, and the like. The contact 11 is a portion contacting with a protecting sheet 20, and a portion welding the protecting sheet 20 to a semiconductor substrate 50 in pressure welding simultaneously. The opening 12 is a portion corresponding to a structure 51 formed in the semiconductor substrate 50, and an opening for radiating UV light to a portion corresponding to the structure 51 of the protecting sheet 20 when mounting the mask 10 on the semiconductor substrate 50 through the protecting sheet 20 simultaneously. The concave 13a is a portion corresponding to a scribing level difference 52 formed in the semiconductor substrate 50 when mounting the mask 10 on the semiconductor substrate 50 through the protecting sheet 20. COPYRIGHT: (C)2006,JPO&NCIPI |
