| 摘要 |
A module (1) includes a ceramic substrate (13), first and second electrodes (4) provided on the ceramic substrate (13), a component (6,8) having third and fourth electrodes (15,16) connected to the first and second electrodes (4), respectively, and a resin (9,11) filled in a space between the component (6,8) and the ceramic substrate (13). The ceramic substrate (13) has a surface thereof having a recess (10A,10B) formed therein. The first and second electrodes (4) are provided on the surface of the ceramic substrate (13) so that the recess (10A,10B) is located between the first and second electrodes (4). The component (6,8) is located over the recess (10A,10B) and spaced from the ceramic substrate (13) with a space including the recess (10A,10B). The space including the recess (10A,10B) is filled with the resin (9,11). The module allows each component (6,8) to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes (4) on the substrate and improving the operation reliability. <IMAGE> |
