ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

摘要

AN OBJECT OF THE PRESENT INVENTION IS TO PROVIDE A DIE-ADHERING ADHESIVE FILM WHICH CAN BE LAMINATED ON A BACK OF A WAFER AT A TEMPERATURE LOWER THAN A SOFTENING TEMPERATURE OF A PROTECTING TAPE FOR AN ULTRA-THIN WAFER, OR A DICING TAPE TO BE LAMINATED,CAN REDUCE A THERMAL STRESS SUCH AS WARPAGE OF A WAFER, CAN SIMPLIFY A STEP OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND IS EXCELLENT IN HEAT RESISTANCE AND HUMIDITY RESISTANCE RELIANCE, AN ADHESIVE SHEET IN WHICH THE ADHESIVE FILM AND A DICING TAPE ARE LAMINATED, AS WELL AS A SEMICONDUCTOR DEVICE.(FIGURE 1)