| 摘要 |
PROBLEM TO BE SOLVED: To achieve through-hole soldering of sufficient quality even if heat capacity of a metal pin is large and sufficient preheating cannot be performed in through-hole soldering of the metal pin installed in a multilayer substrate and a through-hole substrate (land) of an electronic apparatus. SOLUTION: For appropriately pre-heating especially the inner face of the through-hole and the metal pin as parts to be soldered, a cylindrical solder iron having the through-hole is used to bring the solder iron into contact with the part to be soldered, and/or inert gas is flowed to the through-hole. Heating gas is supplied to the part to be soldered and it is pre-heated. Thus, appropriate through-hole soldering is attained. COPYRIGHT: (C)2011,JPO&INPIT |
