| 摘要 |
PROBLEM TO BE SOLVED: To secure a predetermined distance between wirings, and to prevent the damage of a lower layer wiring when forming an insulator film formed for securing a distance between the wirings by patterning, etc. SOLUTION: The semiconductor device includes a semiconductor substrate 11, a first wiring 1 that is formed on the semiconductor substrate 11, a second wiring 2 that is formed to cross over the first wiring 1 with a space 9 interposed therebetween at a cross portion in which the first wiring 1 and the second wiring 2 cross each other, a protective film 8 that is formed on the semiconductor substrate 11 so as to cover at least a part of the first wiring 1, the part being located under the second wiring 2 in the cross portion, and an insulator film 3 that is formed on the semiconductor substrate 11 in an island shape on the protective film 8 under the second wiring 2 in the cross portion to be located inside than the edge portion of the protective film 8 and so as to cover the first wiring 1 in the cross portion. COPYRIGHT: (C)2011,JPO&INPIT
|
