发明名称 HEAT INSULATING STRUCTURE AND STORAGE DEVICE HAVING THE HEAT INSULATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat insulating structure that inexpensively achieves heat insulation with high performance, and a storage device having the heat insulating structure. SOLUTION: The heat insulating structure 1 includes a fan 33 which sucks air from the outside 10b and blows the air toward the inside 10a so as to cool heat staying in the inside 10a, and a panel 35 formed in a box shape, having a flow passage for air in a box portion blown by the fan 33 from the outside 10b to the inside 10a, and achieving heat insulation in a unit 10. The panel 35 includes a plurality of air intakes 37 which are arranged along an outer edge 35c of a front 35b nearby the outer edge 35c, and suck air from the outside 10b, an air supply hole 39 which is arranged not on the same straight line with the air intakes 37, and sends the air sucked from the air intakes 37 to the inside 10a, and a flow passage portion 41 which is a flow passage formed between the front 35a and a back 35a and supplies the air from the air intakes 37 to the air supply hole 39, and is formed in contact with the inside 10a with the back 35a interposed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010258285(A) 申请公布日期 2010.11.11
申请号 JP20090108034 申请日期 2009.04.27
申请人 GOYO ELECTRONICS CO LTD;NIKON CORP 发明人 TARUKAWA HIDEYUKI;KOBAYASHI MASAHIKO;KUBOTA MITSUHIRO;ISHIZAWA TAKUMA
分类号 H05K7/20 主分类号 H05K7/20
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