| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensor in structure for preventing occurrence of failure because of adhesion of resin to a sensor circuit in secondary formation. SOLUTION: A hollow part 5a of a plate-like mold IC 5 is covered with a shield case 6 or a terminal component 7 to seal the hollow part 5a, thus preventing resin from penetrating the side of the hollow part 5a by the plate-like mold IC 5, the shield case 6, or the terminal component 7 when performing secondary formation and hence forming structure for preventing failure from occurring because of adhesion of resin to the sensor circuit in secondary formation of a pressure sensor 1. COPYRIGHT: (C)2011,JPO&INPIT |
