| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board, which has a low dielectric constant and a dielectric tangent, as well as excellent heat resistance and adhesiveness; and a prepreg and a laminate using the same. SOLUTION: The resin composition for the circuit board comprises a compound containing two or more maleimide groups in the molecule, a 2,2,4-trimethyl-1,2-dihydroquinoline polymer, and an aromatic compound having two or more hydroxyl groups in the ortho position, wherein the aromatic compound having two or more hydroxyl groups in the ortho position is 2,3-dihydroxynaphthalene. COPYRIGHT: (C)2011,JPO&INPIT
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