| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method with which heating processes can be decreased, quality of electric bonding can be stably maintained, and necessary strength can be obtained. <P>SOLUTION: A semiconductor package component (3) is mounted on a substrate (1) such that the electrode (2) of the substrate (1) and the electrode of the semiconductor package component (3) abut on each other with a bonding metal (4) therebetween. A reinforcing adhesive (5a) is applied between the substrate (1) and the outer surface of the semiconductor package component (3), reflow is performed such that the bonding metal (4) is melted, and while the bonding metal (4) is solidified, the reinforcing adhesive (5a) is cured. <P>COPYRIGHT: (C)2011,JPO&INPIT |
