| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a holding member that is improved in holding strength for an electronic component on a substrate and reducible in damage to a through-hole wall surface. <P>SOLUTION: The holding member includes a lock portion which is locked to a reverse surface of the substrate in a fixation state wherein the electronic component is fixed to the substrate, a spring portion which is coupled to a base portion, forms a flat plate shape before being displaced to be potentially displaced in a plate thickness direction, and is arranged on the top surface of the substrate in the fixation state, a connection portion which connects the lock portion and spring portion to each other, is partially arranged in a through-hole in the fixation state, and constitutes a first leg portion together with the lock portion and spring portion, and a holding portion which is extended from the base portion in the same direction as the first leg portion at a position different from the first leg portion. The end surface of the holding portion comes in contact with the surface of the substrate in the fixation state, and the plate thickness direction of the spring portion is nearly parallel to the direction extended from the connection portion of the lock portion in the state of being displaced. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
