| 摘要 |
PROBLEM TO BE SOLVED: To provide a communication module that can be made into thin shape. SOLUTION: A communication module comprises: a module mounting member including a piezoelectric oscillator mounting pad provided on one principal surface so as to surround a recessed part while providing a first integrated circuit element mounting pad and the recessed part on the one principal surface; a first integrated circuit element mounted in the first integrated circuit element mounting pad; a piezoelectric oscillator mounted in the piezoelectric oscillator mounting pad, the piezoelectric oscillator including an element mounting member, a piezoelectric vibrating element mounted on one principal surface of the element mounting member, a cover member for air-tightly sealing the piezoelectric vibrating element, a second integrated circuit element mounted on another principal surface of the cover member, and a module mounting member connecting terminal provided on the other principal surface of the cover member; and a resin layer provided to cover the piezoelectric oscillator and the first integrated circuit element. COPYRIGHT: (C)2011,JPO&INPIT |
