| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided or multilayer printed board, which forms a high density and fine pattern and improves reliability of interlayer connection while the board on which a circuit pattern is formed is thinned and flattened. <P>SOLUTION: A conductive layer (4A) is laminated on a support member (4B) and a plate is prepared. A first conductor circuit (2a) and a bump (3a), which are formed in a first plate (4), and a second conductor circuit (2b) formed in a second plate (4) are oppositely disposed in necessary positions while an insulating substrate (1) in a semi-cured state is intervened, and they are heated and pressurized. The first conductor circuit (2a) is buried on a first face (1a) side of the insulating substrate (1) and a second conductor circuit (2b) on a second face (1b) side of the insulating substrate. The bump (3a) penetrating the insulating substrate (1) electrically connects the first conductor circuit (2a) with the second conductor circuit (2b). The insulating substrate (1) is cured, and the plate comprising the conductive layer is removed, so that the printed board is manufactured. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
