| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an external terminal electrode becomes partially wider at an external layer portion undesirably since a ridge portion and a corner portion are rounded as a ceramic element body of a multilayer ceramic electronic component is subjected to polishing processing, an internal conductor exposed on a side face of the ceramic element body is also ground at this time to scatter metal constituting the internal conductor, but a metal scatter amount is larger on an external layer side in the laminating direction of the ceramic element body than on a center portion side and when the external terminal electrode is formed by plating, a plating film is grown containing the scattered metal as a core. SOLUTION: In the multilayer ceramic electronic component, in an exposed area 33 defined by exposed portions 22 of a plurality of internal conductors 23, an area ratio of exposed portions in an end section 33a is smaller than that in a center section 33. Consequently, a metal scatter amount in the exposed portion area end 33a is relatively reduced during polishing to suppress a plating film to form the external terminal electrode from becoming partially wider at the external layer portion even when the plating film is grown containing the scattered metal as the core. COPYRIGHT: (C)2011,JPO&INPIT
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