发明名称 Resin for photoresist composition, photoresist composition and method for forming resist pattern
摘要 A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in theα-position to the hydroxyl group has at least one electron attractive group.
申请公布号 US7829259(B2) 申请公布日期 2010.11.09
申请号 US20090365752 申请日期 2009.02.04
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 HADA HIDEO;TAKESHITA MASARU;MATSUMARU SHOGO;SHIMIZU HIROAKI
分类号 G03F7/033;G03F7/039;C08F2/38;C08F220/28;G03F7/004;G03F7/028;H01L21/027;H01L21/30 主分类号 G03F7/033
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