PURPOSE: A chip-on-board typed package is provided to reduce coupling between adjacent external connection terminals by interposing a line part expanded from a ground pad between the external connection terminals. CONSTITUTION: A ground pad(121) is arranged on a first side of a substrate. The ground pad includes a body part(121a) and one or more line parts(121b). Conductive pads(120) are adjacently arranged to the body part. The line parts are expanded to a space between the conductive pads. The conductive pads include one or more signal pads(122).
