发明名称 |
PRESSURE SENSOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A pressure sensor which increases the pressure sensitivity of a pressure sensor, and a manufacturing method thereof are provided to secure the bond strength with a pedestal by enlarging a junction area. CONSTITUTION: A pressure sensor comprises a sensor chip(10) and a pedestal(11). The sensor chip comprises a first semiconductor layer(1) and a second semiconductor layer(3). The semiconductor layer has an opening. The second semiconductor layer is formed on the semiconductor layer. The second semiconductor layer has a concave part in which a diaphragm is. A pedestal comprises a pressure guiding hole(17).</p> |
申请公布号 |
KR20100118513(A) |
申请公布日期 |
2010.11.05 |
申请号 |
KR20100035351 |
申请日期 |
2010.04.16 |
申请人 |
YAMATAKE CORPORATION |
发明人 |
TOKUDA TOMOHISA;TOJO HIROFUMI |
分类号 |
G01L9/08;G01L7/08;G01L9/00;H01L29/84;H01L41/00 |
主分类号 |
G01L9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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